8419.89.95.85/Gallium Arsenide Wafer Grinder/China

Gallium Arsenide Wafer Grinder from China

Specialized grinder for back-thinning GaAs compound semiconductor wafers to device fabrication thicknesses with integrated cooling systems. Specifically HTS 8419.89.95.85 for 'other materials' (non-silicon) wafer preparation equipment.

Duty Rate — China → United States

39.2%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
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Import Tips

• Explicitly declare GaAs/compound semiconductor use to qualify for 'other materials' subheading

• Include material safety data for gallium compounds in shipping docs

• Silicon versions use 8419.89.9580; ensure material specificity prevents misclassification

Gallium Arsenide Wafer Grinder from China — Import Duty Rate | HTS 8419.89.95.85