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8419.89.95.40/Epitaxial Reactor Cold Wall System/Japan

Epitaxial Reactor Cold Wall System from Japan

Cold wall cooling assembly for MOCVD epitaxial reactors, maintaining chamber walls at stable low temperatures during high-heat thin film deposition on wafers. Falls under 8419.89.9540 as cooling equipment for semiconductor processing temperature management. Critical for layer uniformity.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Submit reactor chamber thermal profile data proving cold wall cooling necessity

• Classify as complete cooling system, not reactor part, to avoid 8479

Epitaxial Reactor Cold Wall System from Japan — Import Duty Rate | HTS 8419.89.95.40