8419.89.95.40/CVD Deposition Chamber Heat Exchanger/Japan

CVD Deposition Chamber Heat Exchanger from Japan

Plate heat exchanger for chemical vapor deposition chambers, cooling precursor gases and reactor walls during thin film deposition on semiconductor wafers. 8419.89.9540 for temperature change treatment in semiconductor manufacturing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify precursor gas thermal profiles and deposition uniformity data

• Classify as cooling exchanger, not reactor part