CVD Deposition Chamber Heat Exchanger from Japan
Plate heat exchanger for chemical vapor deposition chambers, cooling precursor gases and reactor walls during thin film deposition on semiconductor wafers. 8419.89.9540 for temperature change treatment in semiconductor manufacturing.
Duty Rate — Japan → United States
14.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify precursor gas thermal profiles and deposition uniformity data
• Classify as cooling exchanger, not reactor part