Post-Saw Wafer Dryer from Japan
Industrial dryer specifically designed to remove cutting fluids from wafers immediately after slicing from crystal boules using heated nitrogen gas. HTS 8419.39.02 applies to this semiconductor-specific drying process involving temperature change.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify gas type (N2) and temperature ranges in technical specs
• Include slurry composition compatibility documentation
• Avoid general spin dryer classification by emphasizing fab integration