Other
Machinery, plant or laboratory equipment, whether or not electrically heated (excluding furnaces, ovens and other equipment of heading 8514), for the treatment of materials by a process involving a change of temperature such as heating, cooking, roasting, distilling, rectifying, sterilizing, pasteurizing, steaming, drying, evaporating, vaporizing, condensing or cooling, other than machinery or plant of a kind used for domestic purposes; instantaneous or storage water heaters, nonelectric; parts thereof: > Dryers: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8419.39.02
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by pulling a seed crystal from molten silicon in a controlled temperature environment. It falls under HTS 8419.39.02 as industrial drying equipment for semiconductor manufacturing processes involving precise temperature changes to evaporate impurities during crystal growth.
Float Zone Crystal Furnace
Industrial furnace employing float zone method to purify and grow semiconductor crystals through zone melting with RF heating and controlled cooling. Classified in 8419.39.02 for its drying and vaporizing processes during material treatment in semiconductor boule production.
Semiconductor Wafer Drying Oven
Precision oven for drying semiconductor wafers after wet processing steps, maintaining controlled low humidity and temperature to prevent contamination. Falls under HTS 8419.39.02 as specialized industrial dryer for temperature-controlled material treatment in chip fabrication.
Crystal Boule Grinder Dryer
Integrated system that grinds semiconductor crystal boules to precise diameter while simultaneously drying to remove grinding fluids and maintain surface quality. HTS 8419.39.02 covers this combined drying process essential for wafer preparation.
Wafer Edge Grind Dryer Station
Equipment for grinding wafer edges to specification followed by heated air drying to remove debris and liquids, critical for handling 300mm wafers without damage. Classified under 8419.39.02 for the temperature-controlled drying component in semiconductor processing.
Post-Saw Wafer Dryer
Industrial dryer specifically designed to remove cutting fluids from wafers immediately after slicing from crystal boules using heated nitrogen gas. HTS 8419.39.02 applies to this semiconductor-specific drying process involving temperature change.
Wafer Lapping Dryer Module
Modular drying unit attached to wafer lapping machines that evaporates lapping fluids using controlled hot air to achieve required flatness for device fabrication. Falls under 8419.39.02 as other industrial dryers for semiconductor material treatment.
CMP Wafer Dryer
Chemical Mechanical Polishing post-process dryer using heated isopropyl alcohol vapor to dry wafers without leaving watermarks, critical for yield in advanced nodes. Classified in HTS Marplane39.02 for semiconductor-specific drying with temperature control.
Silicon Ingot Drying Chamber
Climate-controlled chamber for drying silicon ingots after acid etch, using laminar flow heated air to remove moisture before slicing. HTS 8419.39.02 covers this industrial drying equipment for semiconductor material preparation.
Gallium Arsenide Wafer Dryer
Specialized dryer for GaAs compound semiconductor wafers using low-temperature nitrogen drying to prevent thermal damage to sensitive materials. Falls under 8419.39.02 per statistical notes for semiconductor processing dryers.
Photoresist Strip Dryer
Inline dryer following photoresist ash/strip process that uses heated clean dry air to remove residual solvents from wafer surfaces before next processing step. Classified HTS 8419.39.02 for semiconductor manufacturing dryers.
Pre-Diffusion Bake Oven
Precision bake oven that drives off solvents from photoresist prior to diffusion furnace processing using ramped temperature profiles. HTS 8419.39.02 as industrial dryer for semiconductor wafer preparation.
Epitaxial Wafer Cool-Down Dryer
Cooling/drying station following epitaxial reactor that controls wafer temperature while removing process gases and moisture using chilled nitrogen. Classified under 8419.39.02 for combined cooling/drying in semiconductor epi process.
Wafer Shipping Dryer
Final drying station before wafer shipment that removes humidity using heat and vacuum to achieve <1% moisture content for long-term storage. HTS 8419.39.02 for industrial semiconductor wafer dryers.