Other
Machinery, plant or laboratory equipment, whether or not electrically heated (excluding furnaces, ovens and other equipment of heading 8514), for the treatment of materials by a process involving a change of temperature such as heating, cooking, roasting, distilling, rectifying, sterilizing, pasteurizing, steaming, drying, evaporating, vaporizing, condensing or cooling, other than machinery or plant of a kind used for domestic purposes; instantaneous or storage water heaters, nonelectric; parts thereof: > Dryers: > Other > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8419.39.02.80
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact diameters and flats, using coolant systems with temperature regulation during abrasion. Classified in HTS 8419.39.0280 for cooling processes integral to material treatment. Prepares boules for wafer slicing in semiconductor fabs.
Silicon Ingot Annealing Oven
Temperature-controlled annealing equipment for stress-relief in silicon ingots post-growth, using ramped heating and slow cooling cycles. Though oven-like, classified under HTS 8419.39.0280 excluding 8514 furnaces, for material treatment via temperature change. Used before boule grinding.
Epitaxial Reactor Vapor Dryer
Dryer integrated with MOCVD reactors to vaporize solvents from epitaxial GaN/SiC wafers using heated inert gas flows. Classifies under HTS 8419.39.0280 for vaporizing and drying in semiconductor layer deposition. Ensures contamination-free thin-film growth.
Wafer Polishing Dryer
Integrated dryer following chemical mechanical polishing (CMP), employing heated air or vacuum to evaporate residuals while controlling temperature. HTS 8419.39.0280 for other dryers involving evaporation in semiconductor processing. Achieves mirror-finish wafer surfaces.
Czochralski Crystal Puller
A machine used to grow monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon, involving precise temperature control for crystallization. Classified under HTS 8419.39.0280 as industrial drying equipment due to the heating and controlled cooling processes essential for crystal formation. This equipment is critical for semiconductor wafer production.
Float Zone Crystal Grower
Equipment that uses a floating molten zone to purify and grow semiconductor crystals like silicon through zone melting, requiring exact heating and cooling. Falls under HTS 8419.39.0280 for its drying and temperature treatment functions in material processing. Used in high-purity wafer boule production.
Wafer Lapping Machine
Industrial machine that laps semiconductor wafers to precise flatness using slurries and temperature-controlled platens for surface preparation. HTS 8419.39.0280 applies due to cooling and drying in the lapping process for wafer fabrication readiness. Ensures dimensional tolerances for chip processing.
Semiconductor Wafer Dryer
High-precision dryer using heated nitrogen or IPA vapor for drying processed semiconductor wafers post-rinse, preventing watermarks via temperature control. Directly under HTS 8419.39.0280 as other industrial dryers for material treatment. Essential in cleanroom wafer fab lines.
Gallium Arsenide Wafer Cooler
Precision cooling station for GaAs wafers after high-temp epitaxy, using cryogenic or thermoelectric cooling to stabilize lattice structures. HTS 8419.39.0280 covers cooling processes in material treatment for semiconductors. Prevents thermal defects in compound semiconductor production.
Wafer Edge Grinding Cooler
Cooling system for edge grinders that maintains low temperatures during wafer periphery shaping to avoid microcracks. HTS 8419.39.0280 for cooling in semiconductor wafer preparation. Improves yield in 300mm wafer processing.