Parts
Industrial or laboratory furnaces and ovens, including incinerators, nonelectric, and parts thereof: > Parts
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8417.90.00.00
Crystal Grinder Post-Process Cooling Zone
Controlled cooling section of nonelectric furnaces following crystal boule grinding, preventing thermal shock in semiconductor material preparation. Under HTS 8417.90.00.00 as industrial furnace parts. Maintains precise cooling rates for crystal integrity.
Czochralski Crystal Puller Heating Chamber
This is the graphite or molybdenum heating chamber used in Czochralski crystal growers for pulling monocrystalline silicon boules in semiconductor manufacturing. It falls under HTS 8417.90.00.00 as a part of a nonelectric industrial furnace/oven designed for high-temperature crystal growth processes. The chamber maintains precise thermal gradients essential for defect-free crystal formation.
Float Zone Crystal Furnace Crucible Support
Ceramic or quartz support assembly for crucibles in float zone semiconductor crystal growth furnaces, operating nonelectrically via RF induction heating. Classified under HTS 8417.90.00.00 as parts of nonelectric industrial furnaces used in semiconductor material processing. Provides precise positioning during zone melting for ultra-pure silicon production.
Wafer Annealing Furnace Muffle
High-temperature resistant muffle (inner chamber) for rapid thermal annealing furnaces used in semiconductor wafer processing to activate dopants and repair crystal damage. Falls under HTS 8417.90.00.00 as parts of nonelectric industrial ovens for semiconductor device fabrication. Constructed from materials tolerating 1200°C+ processing temperatures.
Diffusion Furnace Quartz Tube Liner
High-purity fused quartz liner inserted into diffusion furnace tubes for dopant diffusion into semiconductor wafers during device fabrication. Classified under HTS 8417.90.00.00 as parts of nonelectric industrial furnaces critical to semiconductor processing. Prevents contamination during high-temperature (900-1200°C) diffusion processes.
Crystal Boule Grinder Furnace Heat Shield
Refractory heat shield for maintaining thermal stability in furnaces used during crystal boule grinding preparation for semiconductor wafer production. Under HTS 8417.90.00.00 as parts of nonelectric industrial furnaces in semiconductor manufacturing workflow. Protects grinding zone from thermal fluctuations.
Wafer Lapping Furnace Process Chamber
Thermal process chamber for post-lapping heat treatment furnaces that stabilize semiconductor wafers before polishing. Classified HTS 8417.90.00.00 as nonelectric industrial furnace parts in wafer preparation equipment. Ensures uniform wafer stress relief after mechanical lapping.
Semiconductor Incinerator Combustion Chamber
Stainless steel or ceramic-lined combustion chamber for nonelectric incinerators treating semiconductor manufacturing process gases and solvents. Falls under HTS 8417.90.00.00 as parts of industrial incinerators (nonelectric) used in cleanroom waste processing. Handles VOCs and hazardous process byproducts.
RTP Furnace Lamp Reflector Assembly
High-reflectivity reflector assembly for directing thermal radiation in Rapid Thermal Processing (RTP) furnaces for semiconductor annealing. HTS 8417.90.00.00 as parts of nonelectric industrial ovens using radiative heating for wafer processing. Gold or specialized coatings maximize thermal efficiency.
Wafer Oxidation Furnace Boat Holder
Precision quartz or silicon carbide holder for wafer boats in thermal oxidation furnaces growing silicon dioxide layers on semiconductor wafers. HTS 8417.90.00.00 as parts of nonelectric industrial furnaces for device fabrication. Ensures uniform oxide thickness across wafer batches.