Rapid Thermal Processing RTP Furnace from Japan
Nonelectric semiconductor furnace using lamp arrays for ultra-fast wafer heating to 1200°C in seconds for annealing and silicide formation. Critical for submicron semiconductor device fabrication preventing dopant redistribution. HTS 8417.80.00.00 for industrial nonelectric processing furnaces.
Duty Rate — Japan → United States
13.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify lamp heating as nonelectric radiant process; provide ramp rate specifications proving semiconductor application
• Ensure cleanroom compatibility certification for preferential treatment