8414.90.91.80/Semiconductor Wafer Polisher Vacuum Pump/Japan

Semiconductor Wafer Polisher Vacuum Pump from Japan

Vacuum pump component for chemical-mechanical wafer polishers preparing wafer surfaces for device fabrication. HTS 8414.90.91.80 per statistical note covering wafer polishers in preparation equipment. Achieves mirror finish critical for lithography processes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• CMP slurry compatibility certification with polisher specs

• Provide incoming wafer thickness vs. post-polish tolerance data

• Avoid generic CMP vac classification under 8414.90.50