Semiconductor Wafer Polisher Vacuum Pump from China
Vacuum pump component for chemical-mechanical wafer polishers preparing wafer surfaces for device fabrication. HTS 8414.90.91.80 per statistical note covering wafer polishers in preparation equipment. Achieves mirror finish critical for lithography processes.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• CMP slurry compatibility certification with polisher specs
• Provide incoming wafer thickness vs. post-polish tolerance data
• Avoid generic CMP vac classification under 8414.90.50