Wafer Lapping Machine Vacuum Pump

Vacuum pump supplying hold-down force for wafer lappers that achieve precise flatness on semiconductor wafers post-slicing, preparing surfaces for fabrication. Classified in HTS 8414.59.65.95 per notes on wafer grinders, lappers, and polishers for semiconductor processing. Critical for dimensional tolerances in device manufacturing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2.3%+35.0%37.3%
🇲🇽Mexico2.3%+10.0%12.3%
🇨🇦Canada2.3%+10.0%12.3%
🇩🇪Germany2.3%+10.0%12.3%
🇯🇵Japan2.3%+10.0%12.3%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8421.39.01Lower: 35% vs 37.3%

If for polishing non-semiconductor materials like optics

Centrifugal/liquid pumps for general polishing exclude semiconductor wafer statistical coverage.

8480.60.00Lower: 17.5% vs 37.3%

If molded plastic pump housings

Material composition shifts to Chapter 84 plastic article headings if not functional pump.

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Import Tips & Compliance

Provide tolerance specs (e.g

flatness <1 micron) to prove semiconductor application; check for ITAR restrictions on dual-use tech

Pitfall: bulk import without serial tracking for traceability

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Wafer Slicing Saw Vacuum Pump

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Semiconductor Wafer Polisher Exhaust Fan

Exhaust fan for wafer polishers that deliver mirror-finish surfaces on semiconductor wafers by chemical-mechanical planarization, removing debris under vacuum conditions. Under HTS 8414.59.65.95 as other fans for statistical note wafer preparation equipment. Ensures particulate-free environment for IC fabrication.

Gallium Arsenide Wafer Grinder Fan

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