Wafer Lapping Machine Vacuum Pump from Japan
Vacuum pump supplying hold-down force for wafer lappers that achieve precise flatness on semiconductor wafers post-slicing, preparing surfaces for fabrication. Classified in HTS 8414.59.65.95 per notes on wafer grinders, lappers, and polishers for semiconductor processing. Critical for dimensional tolerances in device manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide tolerance specs (e.g
• flatness <1 micron) to prove semiconductor application; check for ITAR restrictions on dual-use tech
• Pitfall: bulk import without serial tracking for traceability