Wafer Lapping Machine Vacuum Pump from Japan
Vacuum pump supplying hold-down force for wafer lappers that achieve precise flatness on semiconductor wafers post-slicing, preparing surfaces for fabrication. Classified in HTS 8414.59.65.95 per notes on wafer grinders, lappers, and polishers for semiconductor processing. Critical for dimensional tolerances in device manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide tolerance specs (e.g
• flatness <1 micron) to prove semiconductor application; check for ITAR restrictions on dual-use tech
• Pitfall: bulk import without serial tracking for traceability