Wafer Lapping Machine Vacuum Pump from China
Vacuum pump supplying hold-down force for wafer lappers that achieve precise flatness on semiconductor wafers post-slicing, preparing surfaces for fabrication. Classified in HTS 8414.59.65.95 per notes on wafer grinders, lappers, and polishers for semiconductor processing. Critical for dimensional tolerances in device manufacturing.
Duty Rate — China → United States
37.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Provide tolerance specs (e.g
• flatness <1 micron) to prove semiconductor application; check for ITAR restrictions on dual-use tech
• Pitfall: bulk import without serial tracking for traceability