Precision Axial Fan for Wafer Lapping Equipment

Precision axial fan for cooling and ventilation during wafer lapping operations that prepare semiconductor wafers to exacting flatness specifications. Prevents thermal distortion during surface preparation for fabrication. HTS 8414.59.65.90 for other axial fans in wafer processing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2.3%+35.0%37.3%
🇲🇽Mexico2.3%+10.0%12.3%
🇨🇦Canada2.3%+10.0%12.3%
🇩🇪Germany2.3%+10.0%12.3%
🇯🇵Japan2.3%+10.0%12.3%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8466.91.50Lower: 35% vs 37.3%

If considered a part of machine tools for semiconductor material working

Wafer grinders/lappers as machine tools have parts provisions in Chapter 84.

8414.59.65.40Higher: 52.3% vs 37.3%

If specifically for wafer polishing stations

Statistical breakout exists for polishers vs general wafer prep fans.

9024.80.00Lower: 35% vs 37.3%

If combined with inline wafer measurement sensors

Hybrid testing/processing equipment with fans shifts to Chapter 90.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Provide engineering drawings linking fan to lapping/polishing tolerance specs

Declare as 'semiconductor wafer processing equipment component' explicitly

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