Precision Axial Fan for Wafer Lapping Equipment from Germany
Precision axial fan for cooling and ventilation during wafer lapping operations that prepare semiconductor wafers to exacting flatness specifications. Prevents thermal distortion during surface preparation for fabrication. HTS 8414.59.65.90 for other axial fans in wafer processing.
Duty Rate — Germany → United States
12.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide engineering drawings linking fan to lapping/polishing tolerance specs
• Declare as 'semiconductor wafer processing equipment component' explicitly