Precision Axial Fan for Wafer Lapping Equipment from China
Precision axial fan for cooling and ventilation during wafer lapping operations that prepare semiconductor wafers to exacting flatness specifications. Prevents thermal distortion during surface preparation for fabrication. HTS 8414.59.65.90 for other axial fans in wafer processing.
Duty Rate — China → United States
37.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Provide engineering drawings linking fan to lapping/polishing tolerance specs
• Declare as 'semiconductor wafer processing equipment component' explicitly