Wafer Slicing Saw Vacuum Pump from Germany
Vacuum pump integrated with diamond wire wafer slicing saws to remove slurry and maintain clean environment during slicing of semiconductor wafers from boules. Falls under HTS 8414.10.00.00 as dedicated vacuum pump for wafer preparation.
Duty Rate — Germany → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document connection to wafer slicing saws with OEM specifications for proper HTS verification
• Declare any abrasive slurry handling features that affect classification