Wafer Slicing Saw Vacuum Pump from Germany
Vacuum pump integrated with diamond wire wafer slicing saws to remove slurry and maintain clean environment during slicing of semiconductor wafers from boules. Falls under HTS 8414.10.00.00 as dedicated vacuum pump for wafer preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document connection to wafer slicing saws with OEM specifications for proper HTS verification
• Declare any abrasive slurry handling features that affect classification