Wafer Slicing Saw Vacuum Pump from China
Vacuum pump integrated with diamond wire wafer slicing saws to remove slurry and maintain clean environment during slicing of semiconductor wafers from boules. Falls under HTS 8414.10.00.00 as dedicated vacuum pump for wafer preparation.
Duty Rate — China → United States
40%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document connection to wafer slicing saws with OEM specifications for proper HTS verification
• Declare any abrasive slurry handling features that affect classification