Wafer Slicing Saw Vacuum Pump from Canada
Vacuum pump integrated with diamond wire wafer slicing saws to remove slurry and maintain clean environment during slicing of semiconductor wafers from boules. Falls under HTS 8414.10.00.00 as dedicated vacuum pump for wafer preparation.
Duty Rate — Canada → United States
12.5%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document connection to wafer slicing saws with OEM specifications for proper HTS verification
• Declare any abrasive slurry handling features that affect classification