8414.10.00.00/Wafer Slicing Saw Vacuum Pump/Canada

Wafer Slicing Saw Vacuum Pump from Canada

Vacuum pump integrated with diamond wire wafer slicing saws to remove slurry and maintain clean environment during slicing of semiconductor wafers from boules. Falls under HTS 8414.10.00.00 as dedicated vacuum pump for wafer preparation.

Duty Rate — Canada → United States

12.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document connection to wafer slicing saws with OEM specifications for proper HTS verification

• Declare any abrasive slurry handling features that affect classification

Wafer Slicing Saw Vacuum Pump from Canada — Import Duty Rate | HTS 8414.10.00.00