Semiconductor Wafer Grinding Coolant Pump from China

High-precision pump for circulating coolant fluids during crystal grinding of semiconductor boules to exact wafer diameters. Essential in wafer preparation equipment to maintain temperature control and surface flatness as per statistical note (b)(ii)(A). Classified in HTS 8413.81.00 as other pumps for semiconductor liquids.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Import Tips

Include SEMI-standard specifications proving use in crystal boule grinding for tariff preference

Maintain records of coolant fluid types used to demonstrate semiconductor-specific application

Avoid general 'coolant pump' descriptions; specify wafer preparation context in invoices

Semiconductor Wafer Grinding Coolant Pump from China — Import Duty Rate | HTS 8413.81.00