Wafer Polishing Head Pneumatic Lift Cylinder from Japan
Pneumatic linear actuator raising/lowering polishing heads onto semiconductor wafers to achieve mirror surface finish required for device fabrication. HTS 8412.90.9025 classification for linear acting pneumatic motor parts in wafer polishers. Controls downforce preventing subsurface damage.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify downforce control range (0.5-5 psi typical); document slurry chemical resistance
• Ensure not classified under general CMP (chemical mechanical polishing) equipment