Wafer Polishing Head Pneumatic Lift Cylinder from Japan
Pneumatic linear actuator raising/lowering polishing heads onto semiconductor wafers to achieve mirror surface finish required for device fabrication. HTS 8412.90.9025 classification for linear acting pneumatic motor parts in wafer polishers. Controls downforce preventing subsurface damage.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify downforce control range (0.5-5 psi typical); document slurry chemical resistance
• Ensure not classified under general CMP (chemical mechanical polishing) equipment