Wafer Polishing Head Pneumatic Lift Cylinder
Pneumatic linear actuator raising/lowering polishing heads onto semiconductor wafers to achieve mirror surface finish required for device fabrication. HTS 8412.90.9025 classification for linear acting pneumatic motor parts in wafer polishers. Controls downforce preventing subsurface damage.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If other lifting/handling equipment
Without semiconductor-specific tolerances, classifies as general material handling lifts.
If with integrated polishing rate measurement
Measuring and checking pneumatic actuators classify under Chapter 90.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Specify downforce control range (0.5-5 psi typical); document slurry chemical resistance
• Ensure not classified under general CMP (chemical mechanical polishing) equipment
Related Products under HTS 8412.90.90.25
Pneumatic Cylinder for Wafer Slicing Saw
This pneumatic linear acting cylinder drives the precise feed mechanism in wafer slicing saws used to cut monocrystalline semiconductor boules into thin wafers. It falls under HTS 8412.90.9025 as a part of linear acting pneumatic motors essential for semiconductor manufacturing equipment. The cylinder provides controlled linear motion critical for maintaining wafer thickness tolerances.
Linear Pneumatic Actuator for Crystal Puller
Pneumatic linear actuator used in Czochralski crystal pullers to control the precise vertical movement of the seed crystal during monocrystalline silicon boule growth. Classified under HTS 8412.90.9025 as a part of linear acting pneumatic motors for semiconductor crystal growing equipment. Provides the controlled linear motion essential for uniform crystal diameter.
Wafer Grinder Pneumatic Feed Cylinder
Pneumatic linear cylinder that controls the feed rate of semiconductor wafers through grinding, lapping, and polishing stations in wafer preparation equipment. Falls under HTS 8412.90.9025 as a linear acting pneumatic motor part specifically for bringing wafers to precise dimensional tolerances. Critical for maintaining wafer flatness required for fabrication processes.
Crystal Grinder Diameter Control Cylinder
Linear pneumatic cylinder used in crystal grinders to precisely control the grinding wheel position while shaping semiconductor boules to exact wafer diameters. Classified HTS 8412.90.9025 as part of linear acting pneumatic motors for semiconductor crystal preparation equipment. Includes flats grinding function indicating conductivity type.
Float Zone Crystal Puller Pneumatic Actuator
Specialized pneumatic linear actuator for float zone crystal growth systems that produces extremely pure monocrystalline semiconductor material. HTS 8412.90.9025 classification as linear acting pneumatic motor part for wafer manufacturing crystal pullers. Controls precise positioning during zone refining process.
Wafer Lapping Machine Pneumatic Pressure Cylinder
Pneumatic linear cylinder applying controlled pressure during wafer lapping operations to achieve critical surface flatness for semiconductor fabrication. Classified under HTS 8412.90.9025 as linear acting pneumatic motor part for wafer preparation equipment. Maintains consistent pressure across wafer surface during polishing.