Wafer Slicing Saw Drive Turbine
Compact steam turbine driving high-precision wafer slicing saws that cut monocrystalline boules into semiconductor wafers. HTS 8406.82.90.00 applies to this other vapor turbine under 40 MW used in wafer preparation equipment per statistical notes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If sold as standalone saw without turbine integration
Sawing machines for working materials shift to Chapter 84 if not specified for semiconductor use.
If when incorporating precision measurement for slicing
Certain testing apparatus for semiconductor wafers in Chapter 90 per statistical notes.
If for rotary positive displacement pumps in saw coolant systems
If the turbine functions mainly as a pump for slicing fluids, reclassifies under 8413.
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Import Tips & Compliance
• Document blade speed and precision tolerances to confirm wafer manufacturing classification
• Avoid common pitfall of classifying as general saw under 8461 without semiconductor context
• Include safety certifications for high-speed rotating equipment
Related Products under HTS 8406.82.90.00
Czochralski Crystal Puller Turbine
A steam turbine component integrated into Czochralski crystal pullers for producing monocrystalline silicon boules in semiconductor manufacturing. Classified under HTS 8406.82.90.00 as an other vapor turbine of output not exceeding 40 MW used in specialized industrial processes. It drives the rotation and heating mechanisms essential for crystal growth.
Float Zone Crystal Grower Turbine
Vapor turbine powering float zone furnaces for high-purity silicon crystal growth in semiconductor production. Falls under HTS 8406.82.90.00 for other turbines ≤40 MW output, distinct from power generation applications. Essential for precise RF heating and zone melting processes.
Crystal Boule Grinder Turbine
Vapor turbine powering grinders that shape semiconductor crystal boules to exact wafer diameters and flats indicating conductivity. Classified in HTS 8406.82.90.00 as other low-output turbine for crystal preparation equipment in semiconductor manufacturing.
Wafer Lapping Polisher Turbine
Small steam turbine for driving lappers and polishers that achieve flatness tolerances on semiconductor wafers before fabrication. Under HTS 8406.82.90.00 for other vapor turbines ≤40 MW in wafer preparation per chapter statistical notes.
Gallium Arsenide Vapor Turbine
Specialized turbine for gallium arsenide crystal growth systems in compound semiconductor production. HTS 8406.82.90.00 covers this other low-power vapor turbine explicitly noted for processing materials like gallium arsenide.
Semiconductor boule Slicer Turbine
Turbine component in wire saw systems slicing semiconductor boules into thin wafers with minimal kerf loss. Fits HTS 8406.82.90.00 as other turbine for wafer slicing saws in statistical note (a)(ii)(B).