8406.82.90.00/Wafer Slicing Saw Drive Turbine/Japan

Wafer Slicing Saw Drive Turbine from Japan

Compact steam turbine driving high-precision wafer slicing saws that cut monocrystalline boules into semiconductor wafers. HTS 8406.82.90.00 applies to this other vapor turbine under 40 MW used in wafer preparation equipment per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document blade speed and precision tolerances to confirm wafer manufacturing classification

• Avoid common pitfall of classifying as general saw under 8461 without semiconductor context

• Include safety certifications for high-speed rotating equipment