Wafer Slicing Saw Drive Turbine from Japan
Compact steam turbine driving high-precision wafer slicing saws that cut monocrystalline boules into semiconductor wafers. HTS 8406.82.90.00 applies to this other vapor turbine under 40 MW used in wafer preparation equipment per statistical notes.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document blade speed and precision tolerances to confirm wafer manufacturing classification
• Avoid common pitfall of classifying as general saw under 8461 without semiconductor context
• Include safety certifications for high-speed rotating equipment