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Indium Bump Preform

Preformed indium spheres for flip-chip bonding in microelectronics packaging. Shaped article of indium, HTS 8112.99.9100.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
๐Ÿ‡จ๐Ÿ‡ณChina4%+25.0%29%
๐Ÿ‡ฒ๐Ÿ‡ฝMexico4%โ€”4%
๐Ÿ‡จ๐Ÿ‡ฆCanada4%โ€”4%
๐Ÿ‡ฉ๐Ÿ‡ชGermany4%โ€”4%
๐Ÿ‡ฏ๐Ÿ‡ตJapan4%โ€”4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8001.20.00Lower: 25% vs 29%

If tin-based solder preform

Solders primarily tin classify under Chapter 80 tin.

8544.49Lower: 16.4% vs 29%

If pre-attached to circuit

Cable assemblies with indium bumps become Chapter 85 electrical.

7117.19.90.00Higher: 31% vs 29%

If jewelry solder use

Imitation jewelry solders in Chapter 71.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code โ€” and can price the duty on it in the same conversation.

Import Tips & Compliance

โ€ข Spherical uniformity cert for bump preform status

โ€ข Flux-free declaration if solder-like

โ€ข ESD-safe packaging documentation