Indium Bump Preform
Preformed indium spheres for flip-chip bonding in microelectronics packaging. Shaped article of indium, HTS 8112.99.9100.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4% | +25.0% | 29% |
| 🇲🇽Mexico | 4% | — | 4% |
| 🇨🇦Canada | 4% | — | 4% |
| 🇩🇪Germany | 4% | — | 4% |
| 🇯🇵Japan | 4% | — | 4% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If tin-based solder preform
Solders primarily tin classify under Chapter 80 tin.
If pre-attached to circuit
Cable assemblies with indium bumps become Chapter 85 electrical.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Spherical uniformity cert for bump preform status
• Flux-free declaration if solder-like
• ESD-safe packaging documentation
Related Products under HTS 8112.99.91.00
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A polished germanium wafer used as a blank for infrared optical lenses in thermal imaging devices. Falls under HTS 8112.99.9100 as an article of germanium, not a finished optical element or waste.
Indium Foil for Thermal Interface
Thin indium foil sheets applied between heat-generating components and heatsinks in electronics for superior thermal conductivity. Classified as an article of indium under HTS 8112.99.9100.
Gallium Metal Beads
Spherical gallium beads used in research and calibration of analytical instruments due to low melting point. HTS 8112.99.9100 covers these as articles of gallium, excluding waste.
Niobium Crucible
High-temperature niobium crucible for melting reactive metals in vacuum furnaces. As a fabricated article of niobium (columbium), it is under HTS 8112.99.9100.
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