8112.99.91.00/Indium Bump Preform/Germany

Indium Bump Preform from Germany

Preformed indium spheres for flip-chip bonding in microelectronics packaging. Shaped article of indium, HTS 8112.99.9100.

Duty Rate — Germany → United States

4%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Spherical uniformity cert for bump preform status

• Flux-free declaration if solder-like

• ESD-safe packaging documentation

Indium Bump Preform from Germany — Import Duty Rate | HTS 8112.99.91.00