Indium Bump Preform from Germany
Preformed indium spheres for flip-chip bonding in microelectronics packaging. Shaped article of indium, HTS 8112.99.9100.
Duty Rate — Germany → United States
4%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Spherical uniformity cert for bump preform status
• Flux-free declaration if solder-like
• ESD-safe packaging documentation