Indium Bump Preform from Japan
Preformed indium spheres for flip-chip bonding in microelectronics packaging. Shaped article of indium, HTS 8112.99.9100.
Duty Rate — Japan → United States
4%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Spherical uniformity cert for bump preform status
• Flux-free declaration if solder-like
• ESD-safe packaging documentation