Molybdenum Sputtering Target Disk

Circular molybdenum target disks for magnetron sputtering in semiconductor metallization layers. Under HTS 8102.99.00.00 as fabricated articles, not unwrought or powder form. 99.999% purity critical for microelectronics.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China3.7%+10.0%13.7%
🇲🇽Mexico3.7%+10.0%13.7%
🇨🇦Canada3.7%+10.0%13.7%
🇩🇪Germany3.7%+10.0%13.7%
🇯🇵Japan3.7%+10.0%13.7%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8473.30Higher: 35% vs 13.7%

If assembled with complete magnetron assembly

Parts of semiconductor machinery classify under 8473 when integral to specific equipment.

8102.96.00Higher: 39.4% vs 13.7%

If imported as plate stock pre-machining

Raw plate form before target fabrication uses dedicated sheet/plate subheading.

2846.90.80Lower: 3.7% vs 13.7%

If chemically treated for ultra-high purity

Rare earth compounds or activated sputtering materials shift to Chapter 28.

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Import Tips & Compliance

Declare backing plate material/composition; copper-backed targets common but must specify to avoid alloy issues

High purity requires third-party assay certificates; CBP often tests for trace elements

Semiconductor end-use mandates supply chain documentation for forced labor compliance

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