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Tungsten Microelectronics Wire

Ultra-fine tungsten wire (down to 10μm) for bonding in semiconductor packaging. As pure tungsten wire, it is covered by HTS 8101.96.00.00.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+35.0%39.4%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪Germany4.4%+10.0%14.4%
🇯🇵Japan4.4%+10.0%14.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8101.99Lower: 13.7% vs 39.4%

If in ribbon or foil form for deposition

Thin foil-like tungsten classifies as 'other articles,' not round wire.

8544.42.20Lower: 35% vs 39.4%

If gold-plated for bonding

Plated micro-wire for electronics falls under Chapter 85 fitted electrical conductors.

3818.00.00Higher: 50% vs 39.4%

If as chemical vapor deposition precursor wire

Wire used in thin-film deposition processes may classify as chemical elements/plates.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Provide SEM images or specs for wire diameter to confirm micro-wire status

Avoid classification as sputter target material under 8101.99 if in ribbon form

Declare cleanroom packaging to prevent contamination claims during customs