Tungsten Microelectronics Wire from Japan
Ultra-fine tungsten wire (down to 10μm) for bonding in semiconductor packaging. As pure tungsten wire, it is covered by HTS 8101.96.00.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide SEM images or specs for wire diameter to confirm micro-wire status
• Avoid classification as sputter target material under 8101.99 if in ribbon form
• Declare cleanroom packaging to prevent contamination claims during customs