Thermal Spray Copper Powder -45+150 Mesh
Spherical copper powder in 45+150 mesh range for HVOF and plasma thermal spray applications. Non-lamellar structure provides consistent melt behavior and coating density. Classified HTS 7406.10.00.00 as non-lamellar copper powder.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If flake powder preferred for arc spray
Flake morphology provides better deposit efficiency in some thermal spray processes.
If imported as part of complete thermal spray equipment
Powder included with spray gun/system classified as machinery parts.
If pre-coated for corrosion resistant applications
Coated metal powders for spray may be classified as manufactured articles.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include thermal spray parameter sheet showing recommended plasma/HVOF settings
• Declare mesh size via ASTM E11 sieve certification for customs verification
• Anti-static packaging required for fine powders to prevent shipping hazards
Related Products under HTS 7406.10.00.00
Spherical Copper Powder 99.9% Pure
High-purity spherical copper powder with non-lamellar structure, produced via gas atomization for uniform particle size. Used in additive manufacturing and metal injection molding. Classified under HTS 7406.10.00.00 as copper powder explicitly excluding lamellar (flake) structures.
Atomized Copper Powder -15 Micron
Fine copper powder atomized to 15 micron average particle size with spherical, non-lamellar morphology. Ideal for powder metallurgy and thermal spray coatings. HTS 7406.10.00.00 covers non-lamellar copper powders regardless of production method.
Copper Powder for 3D Metal Printing
High-flow spherical copper powder optimized for selective laser melting (SLM) 3D printing processes. Non-lamellar structure ensures excellent powder bed density and laser absorption. Falls under HTS 7406.10.00.00 for non-lamellar copper powders used in advanced manufacturing.
Electrolytic Copper Powder 10-44 Microns
Dendritic copper powder produced by electrolytic deposition, featuring irregular but non-lamellar structure. Particle size range 10-44 microns suitable for friction materials and carbon brushes. HTS 7406.10.00.00 includes electrolytic powders unless specifically lamellar.
Gas Atomized Copper Alloy Powder C11000
C11000 electrolytic tough pitch copper powder produced by gas atomization, featuring spherical non-lamellar particles. Contains 99.9% copper with controlled oxygen for brazing and PM applications. Classified under HTS 7406.10.00.00 as it meets non-lamellar structure definition.
Copper Powder for MIM Applications
Ultra-fine spherical copper powder designed for metal injection molding with narrow particle distribution. Non-lamellar structure provides optimal packing density in MIM feedstocks. HTS 7406.10.00.00 specifically for non-lamellar copper powders used in advanced manufacturing.