Gas Atomized Copper Alloy Powder C11000
C11000 electrolytic tough pitch copper powder produced by gas atomization, featuring spherical non-lamellar particles. Contains 99.9% copper with controlled oxygen for brazing and PM applications. Classified under HTS 7406.10.00.00 as it meets non-lamellar structure definition.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If master alloy with >10% other elements
Copper master alloys with significant alloying elements classified separately from pure copper.
If alloy specifically processed into flake form
Even copper alloy powders lamellar in structure fall under flake classification.
If containing >2% iron or other base metals
Powders with significant iron content may be classified as iron-based rather than copper.
Not sure which classification is right?
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Import Tips & Compliance
• Include alloy chemistry certificate specifying UNS C11000 composition and oxygen levels
• Declare Hall flow rate (typically 25-35 sec/50g) as indicator of spherical morphology
• For aerospace applications, provide lot traceability back to melt certification
Related Products under HTS 7406.10.00.00
Spherical Copper Powder 99.9% Pure
High-purity spherical copper powder with non-lamellar structure, produced via gas atomization for uniform particle size. Used in additive manufacturing and metal injection molding. Classified under HTS 7406.10.00.00 as copper powder explicitly excluding lamellar (flake) structures.
Atomized Copper Powder -15 Micron
Fine copper powder atomized to 15 micron average particle size with spherical, non-lamellar morphology. Ideal for powder metallurgy and thermal spray coatings. HTS 7406.10.00.00 covers non-lamellar copper powders regardless of production method.
Copper Powder for 3D Metal Printing
High-flow spherical copper powder optimized for selective laser melting (SLM) 3D printing processes. Non-lamellar structure ensures excellent powder bed density and laser absorption. Falls under HTS 7406.10.00.00 for non-lamellar copper powders used in advanced manufacturing.
Electrolytic Copper Powder 10-44 Microns
Dendritic copper powder produced by electrolytic deposition, featuring irregular but non-lamellar structure. Particle size range 10-44 microns suitable for friction materials and carbon brushes. HTS 7406.10.00.00 includes electrolytic powders unless specifically lamellar.
Copper Powder for MIM Applications
Ultra-fine spherical copper powder designed for metal injection molding with narrow particle distribution. Non-lamellar structure provides optimal packing density in MIM feedstocks. HTS 7406.10.00.00 specifically for non-lamellar copper powders used in advanced manufacturing.
Thermal Spray Copper Powder -45+150 Mesh
Spherical copper powder in 45+150 mesh range for HVOF and plasma thermal spray applications. Non-lamellar structure provides consistent melt behavior and coating density. Classified HTS 7406.10.00.00 as non-lamellar copper powder.