Atomized Copper Powder -15 Micron

Fine copper powder atomized to 15 micron average particle size with spherical, non-lamellar morphology. Ideal for powder metallurgy and thermal spray coatings. HTS 7406.10.00.00 covers non-lamellar copper powders regardless of production method.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

7403.11.00.00Lower: 26% vs 35%

If refined but in unwrought form >99.25% pure

High purity refined copper in forms other than powder classified as unwrought copper.

7406.20.00.00Same rate: 35%

If intentionally flattened or lamellar morphology

Powders with plate-like or flake structure specifically excluded from 7406.10.

8311.10.00.00Same rate: 35%

If sold as welding or brazing preparations

Copper powders specifically prepared for soldering/brazing classified as cored wire filler metal.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include scanning electron microscope (SEM) images in documentation to prove spherical non-lamellar structure

Specify oxygen content (<300 ppm typical) as high oxygen may trigger reclassification as scrap or waste

For EU imports, ensure REACH pre-registration for copper metal powders as hazardous substances

Related Products under HTS 7406.10.00.00

Spherical Copper Powder 99.9% Pure

High-purity spherical copper powder with non-lamellar structure, produced via gas atomization for uniform particle size. Used in additive manufacturing and metal injection molding. Classified under HTS 7406.10.00.00 as copper powder explicitly excluding lamellar (flake) structures.

Copper Powder for 3D Metal Printing

High-flow spherical copper powder optimized for selective laser melting (SLM) 3D printing processes. Non-lamellar structure ensures excellent powder bed density and laser absorption. Falls under HTS 7406.10.00.00 for non-lamellar copper powders used in advanced manufacturing.

Electrolytic Copper Powder 10-44 Microns

Dendritic copper powder produced by electrolytic deposition, featuring irregular but non-lamellar structure. Particle size range 10-44 microns suitable for friction materials and carbon brushes. HTS 7406.10.00.00 includes electrolytic powders unless specifically lamellar.

Gas Atomized Copper Alloy Powder C11000

C11000 electrolytic tough pitch copper powder produced by gas atomization, featuring spherical non-lamellar particles. Contains 99.9% copper with controlled oxygen for brazing and PM applications. Classified under HTS 7406.10.00.00 as it meets non-lamellar structure definition.

Copper Powder for MIM Applications

Ultra-fine spherical copper powder designed for metal injection molding with narrow particle distribution. Non-lamellar structure provides optimal packing density in MIM feedstocks. HTS 7406.10.00.00 specifically for non-lamellar copper powders used in advanced manufacturing.

Thermal Spray Copper Powder -45+150 Mesh

Spherical copper powder in 45+150 mesh range for HVOF and plasma thermal spray applications. Non-lamellar structure provides consistent melt behavior and coating density. Classified HTS 7406.10.00.00 as non-lamellar copper powder.