BT Resin for Multilayer PCB Laminates
Pelletized bismaleimide copolymer resin specifically matching the named chemical structure in HTS 3911.90.35.00, supplied in primary form for laminate production. Its high Tg (glass transition) makes it ideal for advanced semiconductor packaging. Classification follows subheading note (a)(1) for polymers with 95%+ named monomer content.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If when processed into rigid laminated sheets with glass fabric
Resin-impregnated laminates become 'cellular plates/sheets' rather than primary polymers.
If for other specified thermosets not matching exact chemical name
Different specific thermosetting polymers have separate statistical suffixes in this series.
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Import Tips & Compliance
• Include FTIR spectra or GPC analysis verifying molecular structure matches named copolymer
• Ensure packaging prevents moisture absorption critical for thermosets
• Pitfall: classifying finished laminates here instead of 3921.13.00
Related Products under HTS 3911.90.35.00
Bismaleimide-Triazine (BT) Resin Pellets
BT resin is a thermosetting polymer formed from 1,1'-Bis(methylenedi-4,1-phenylene)-1H-pyrrole-2,5-dione copolymerized with 4,4'-methylenebis(benzeneamine), used in high-performance laminates. It falls under HTS 3911.90.35.00 due to its specific aromatic thermosetting composition in primary pellet form. This material provides excellent thermal stability for electronics applications.
Hydrocarbon Novolac Cyanate Ester Resin Granules
A thermosetting resin derived from hydrocarbon novolac cyanate ester, specified under HTS 3911.90.35.00 for its aromatic-modified structure in primary granular form. Used in aerospace composites for superior heat resistance and low dielectric properties. Meets chapter note requirements for polymers obtained from modified aromatic monomers.
Cyanate Ester Prepolymer Powder
Hydrocarbon novolac cyanate ester in powdered primary form, directly specified in HTS 3911.90.35.00 for aromatic thermosetting resins. Used in molding compounds for IC packaging with excellent electrical properties. Polymer classification per note 3 to Chapter 39 for these specialized products.
High-Tg Bismaleimide Resin Flakes
Flake-form bismaleimide-triazine copolymer per exact chemical specification of HTS 3911.90.35.00, in primary form for composite prepreg production. Offers Tg >250°C for demanding telecom applications. Aromatic monomer content exceeds 95% threshold per subheading note.
Aerospace-Grade Cyanate Ester Resin
Hydrocarbon novolac cyanate ester resin meeting HTS 3911.90.35.00 specification for thermosetting aromatic polymers in primary forms. Critical for RTM processing in aircraft radomes. Low moisture absorption and high char yield characteristics.
BT Resin Molding Compound Base
Unfilled bismaleimide resin base for encapsulation compounds, classified under HTS 3911.90.35.00 as specified thermosetting copolymer. Provides ultra-low CTE matching silicon. Primary form before filler addition.