High-Tg Bismaleimide Resin Flakes

Flake-form bismaleimide-triazine copolymer per exact chemical specification of HTS 3911.90.35.00, in primary form for composite prepreg production. Offers Tg >250°C for demanding telecom applications. Aromatic monomer content exceeds 95% threshold per subheading note.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

3920.99.20Higher: 39.2% vs 35%

If containing >50% plasticizers by weight

Per subheading 3920.43 note, plasticizer-containing polymers shift to non-primary forms.

3911.90.10Same rate: 35%

If for hydrocarbon novolac resins without cyanate modification

Unmodified versions fall into the simpler hydrocarbon resin subheading.

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Import Tips & Compliance

Document flake form qualifies as 'primary forms' not plates/sheets

Verify no fiber reinforcement present

Watch for reclassification as 3911.90.55 if minor formulation changes

Related Products under HTS 3911.90.35.00

Bismaleimide-Triazine (BT) Resin Pellets

BT resin is a thermosetting polymer formed from 1,1'-Bis(methylenedi-4,1-phenylene)-1H-pyrrole-2,5-dione copolymerized with 4,4'-methylenebis(benzeneamine), used in high-performance laminates. It falls under HTS 3911.90.35.00 due to its specific aromatic thermosetting composition in primary pellet form. This material provides excellent thermal stability for electronics applications.

Hydrocarbon Novolac Cyanate Ester Resin Granules

A thermosetting resin derived from hydrocarbon novolac cyanate ester, specified under HTS 3911.90.35.00 for its aromatic-modified structure in primary granular form. Used in aerospace composites for superior heat resistance and low dielectric properties. Meets chapter note requirements for polymers obtained from modified aromatic monomers.

BT Resin for Multilayer PCB Laminates

Pelletized bismaleimide copolymer resin specifically matching the named chemical structure in HTS 3911.90.35.00, supplied in primary form for laminate production. Its high Tg (glass transition) makes it ideal for advanced semiconductor packaging. Classification follows subheading note (a)(1) for polymers with 95%+ named monomer content.

Cyanate Ester Prepolymer Powder

Hydrocarbon novolac cyanate ester in powdered primary form, directly specified in HTS 3911.90.35.00 for aromatic thermosetting resins. Used in molding compounds for IC packaging with excellent electrical properties. Polymer classification per note 3 to Chapter 39 for these specialized products.

Aerospace-Grade Cyanate Ester Resin

Hydrocarbon novolac cyanate ester resin meeting HTS 3911.90.35.00 specification for thermosetting aromatic polymers in primary forms. Critical for RTM processing in aircraft radomes. Low moisture absorption and high char yield characteristics.

BT Resin Molding Compound Base

Unfilled bismaleimide resin base for encapsulation compounds, classified under HTS 3911.90.35.00 as specified thermosetting copolymer. Provides ultra-low CTE matching silicon. Primary form before filler addition.