BT Resin for Multilayer PCB Laminates from Japan
Pelletized bismaleimide copolymer resin specifically matching the named chemical structure in HTS 3911.90.35.00, supplied in primary form for laminate production. Its high Tg (glass transition) makes it ideal for advanced semiconductor packaging. Classification follows subheading note (a)(1) for polymers with 95%+ named monomer content.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include FTIR spectra or GPC analysis verifying molecular structure matches named copolymer
• Ensure packaging prevents moisture absorption critical for thermosets
• Pitfall: classifying finished laminates here instead of 3921.13.00