Double-Sided Polished Boron-Doped Silicon Wafers from Japan
DSP prime silicon wafers p-type boron-doped, mirror polished both sides for MEMS and SOI processing. Standard electronic substrate in disc form. 3818.00.00 for polished doped wafers.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Polish quality (DSP/SSP) affects value declaration
• Class 1 cleanroom wafers need sealed transport