Double-Sided Polished Boron-Doped Silicon Wafers from China
DSP prime silicon wafers p-type boron-doped, mirror polished both sides for MEMS and SOI processing. Standard electronic substrate in disc form. 3818.00.00 for polished doped wafers.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Polish quality (DSP/SSP) affects value declaration
• Class 1 cleanroom wafers need sealed transport