HFC-23 Semiconductor Etch Gas

Ultra-high purity trifluoromethane (HFC-23) used in plasma etching processes for semiconductor manufacturing, particularly for tungsten and oxide etch applications. Classified in HTS 2903.41.10.00 as a separate chemically defined fluorinated hydrocarbon meeting Chapter 29 heading requirements.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China3.7%+10.0%13.7%
🇲🇽Mexico3.7%+10.0%13.7%
🇨🇦Canada3.7%+10.0%13.7%
🇩🇪Germany3.7%+10.0%13.7%
🇯🇵Japan3.7%+10.0%13.7%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

2811.29.50.00Higher: 38.7% vs 13.7%

If marketed primarily as non-organic gas for industrial processes

Gases not qualifying as organic compounds could shift to Chapter 28 inorganic chemicals.

3824.99Higher: 15% vs 13.7%

If specialty gas mixtures for semiconductor processes

Mixtures with carrier gases or etchants classify as prepared chemical mixtures under 3824.

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Import Tips & Compliance

Require SEMI-standard purity certificates (99.999%+) and confirm no moisture/particulates per semiconductor gas specs

DOT UN1048 labeling required; ensure compatibility with stainless steel or aluminum cylinders

Avoid industrial-use misclassification to 3824; pure HFC-23 remains Chapter 29 regardless of end-use

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