HFC-23 Semiconductor Etch Gas from China
Ultra-high purity trifluoromethane (HFC-23) used in plasma etching processes for semiconductor manufacturing, particularly for tungsten and oxide etch applications. Classified in HTS 2903.41.10.00 as a separate chemically defined fluorinated hydrocarbon meeting Chapter 29 heading requirements.
Duty Rate — China → United States
16.2%
Rate breakdown
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Require SEMI-standard purity certificates (99.999%+) and confirm no moisture/particulates per semiconductor gas specs
• DOT UN1048 labeling required; ensure compatibility with stainless steel or aluminum cylinders
• Avoid industrial-use misclassification to 3824; pure HFC-23 remains Chapter 29 regardless of end-use