CVC Z-400 Sputtering System
> The CVC Z-400 Sputtering System is a planar magnetron PVD apparatus for semiconductor metallization layers, featuring cryogenic pumping and substrate preheat stations. It is a proven platform for aluminum and titanium deposition. This apparatus falls under tariff item 8543.70.00 as an "other machine" with an individual function for sputter deposition.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the system is configured primarily for substrate heating and handling
Machines with individual functions not specified elsewhere may fall under heading 84.79.
If importing only the sputtering cathodes or targets
Parts of heading 85.43 machines are classified under 8543.90.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• > Ensure the system is described as a complete sputtering apparatus, not as a vacuum system, to support classification under 8543.70.00
• Provide information on the substrate handling capabilities to demonstrate the individual function
• Check if the system requires any special permits for cryogenic fluids
Related Products under Tariff item 8543.70.00
AJA International Orion Series Sputtering System
> The AJA International Orion Series Sputtering System is a research-grade physical vapor deposition (PVD) apparatus used for thin film deposition on substrates up to 8 inches. It supports DC/RF magnetron sputtering with multiple guns and substrate bias, making it suitable for semiconductor and materials science research. This apparatus falls under tariff item 8543.70.00 as an "other machine" with an individual function not specified elsewhere in Chapter 85.
Angstrom Engineering Evovac Deposition System
> The Angstrom Engineering Evovac Deposition System is a multi-technique PVD apparatus combining thermal evaporation, sputtering, and organic deposition for OLED and organic electronics research. Its modular design with glovebox integration supports advanced thin film applications. It qualifies under tariff item 8543.70.00 as an "other machine" with an individual function for material deposition.
Applied Materials Endura PVD Cluster Tool
> The Applied Materials Endura PVD Cluster Tool is an advanced physical vapor deposition apparatus for high-volume semiconductor manufacturing, featuring multiple process modules for metal and barrier layer deposition. It uses a cluster tool architecture for sequential processing. This apparatus falls under tariff item 8543.70.00 as an "other machine" with an individual function for thin film deposition.
CHA Industries Mark 50 Evaporation System
> The CHA Industries Mark 50 Evaporation System is a thermal evaporation PVD apparatus with a bell jar vacuum system for metallization of semiconductor wafers and MEMS devices. It features resistance and e-beam evaporation sources. This apparatus qualifies under tariff item 8543.70.00 as an "other machine" with an individual function for thin film deposition.
Denton Vacuum Explorer HP PVD System
> The Denton Vacuum Explorer HP PVD System supports sputtering, evaporation, and PECVD for high-throughput coating applications in electronics manufacturing. It features automated load locks for efficient processing. This apparatus qualifies under tariff item 8543.70.00 as an "other machine" with an individual function for thin film deposition.
Kurt J. Lesker PVD 75 Physical Vapor Deposition System
> The Kurt J. Lesker PVD 75 is a compact physical vapor deposition apparatus used for thin film deposition via evaporation or sputtering in semiconductor and optics manufacturing. It incorporates vacuum chambers and electron beam sources. This apparatus falls under tariff item 8543.70.00 as an "other machine" with an individual function for material deposition.