Via Filling Electrolytic Cell
> A modular electrolytic cell for copper electrofilling microvias in high-density interconnect PCBs. It features precise anode-cathode spacing for blind and buried via metallization, functioning as an electroplating apparatus. This cell is classified under the tariff item for machines and apparatus for electroplating.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
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Import Tips & Compliance
• > Classify the cell as an electroplating apparatus, not as a general container
• Provide technical specifications showing its electrolytic function
• Ensure that any associated chemicals comply with Canadian import regulations
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