Via Filling Electrolytic Cell from China
A modular electrolytic cell for copper electrofilling microvias in high-density interconnect (HDI) PCBs, featuring precise anode-cathode spacing for blind/buried via metallization. This cell is an apparatus for electroplating. It falls under tariff item 8543.30.00 as a machine for electroplating.
Duty Rate — China → Canada
0%
Import Tips
• Classify this cell under 8543.30.00 as an electroplating apparatus
• Ensure its design for microvia filling is documented, as general electrolytic cells may differ
• Provide technical data on anode-cathode spacing and its role in HDI production