Via Filling Electrolytic Cell from Japan
> A modular electrolytic cell for copper electrofilling microvias in high-density interconnect PCBs. It features precise anode-cathode spacing for blind and buried via metallization, functioning as an electroplating apparatus. This cell is classified under the tariff item for machines and apparatus for electroplating.
Duty Rate — Japan → Canada
0%
Import Tips
• > Classify the cell as an electroplating apparatus, not as a general container
• Provide technical specifications showing its electrolytic function
• Ensure that any associated chemicals comply with Canadian import regulations