Other
Machinery parts, not containing electrical connectors, insulators, coils, contacts or other electrical features, not specified or included elsewhere in this Chapter. > Other > Other
Duty Rate (from China)
Subheadings
Products classified under Tariff item 8487.90
Automotive Crankshaft Oil Seal
A radial oil seal designed for sealing the crankshaft in internal combustion engines, preventing oil leakage between the rotating shaft and engine block. Made from nitrile rubber with a metal reinforced outer casing, this non-electrical machinery part is not specified or included elsewhere in Chapter 84, falling under tariff item 8487.90.00.
8487.90.00CMP Polisher Retaining Ring
A consumable retaining ring used in chemical mechanical planarization (CMP) equipment to hold the polishing pad in place on the platen edge while allowing controlled pad wear during semiconductor wafer processing. Made from engineered plastic composite, this part has no electrical connectors, insulators, coils, contacts, or other electrical features, and is not specified or included elsewhere in Chapter 84.
8487.90.00Crystal Boule Grinder Workholding Chuck
A precision workholding chuck used to secure semiconductor crystal boules during diameter grinding to achieve exact wafer specifications. This mechanical part ensures accurate rotation without any electrical components, making it a machinery part not specified or included elsewhere in Chapter 84.
8487.90.00Crystal Grinder Coolant Nozzle Assembly
An adjustable nozzle assembly that delivers coolant precisely to the semiconductor crystal grinding zone to control heat and remove debris during processing. This purely mechanical fluid delivery part has no electrical features and is not specified or included elsewhere in Chapter 84, qualifying it under tariff item 8487.90.00.
8487.90.00Czochralski Crystal Puller Furnace Chamber
A critical replaceable part in Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. The furnace chamber provides the high-temperature controlled environment necessary for crystal growth and is a mechanical part without electrical features, not specified or included elsewhere in Chapter 84.
8487.90.00Double-Sided Wafer Lapper Ring Carrier
A thin ring carrier that holds multiple semiconductor wafers between upper and lower lapping plates for simultaneous double-sided lapping, ensuring uniform material removal across the wafer batch. This non-electrical process part is not specified or included elsewhere in Chapter 84, falling under tariff item 8487.90.00.
8487.90.00Float Zone Crystal Grower Quartz Crucible
A high-purity quartz crucible used in float zone crystal growers to contain molten silicon during the zone refining process for semiconductor material production. This non-electrical part maintains material purity at extreme temperatures and is not specified or included elsewhere in Chapter 84, qualifying under tariff item 8487.90.00.
8487.90.00Semiconductor Wafer Polishing Pad
A polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to achieve an atomic-level surface finish. This consumable part interfaces with polishing platens in wafer processing equipment and has no electrical features, making it a machinery part not specified or included elsewhere in Chapter 84.
8487.90.00Silicon Boule Flattener Jig
A custom jig fixture for holding semiconductor silicon boules during flat grinding operations that create orientation flats indicating crystal properties. This mechanical alignment tool has no electrical features and is not specified or included elsewhere in Chapter 84, falling under tariff item 8487.90.00.
8487.90.00Wafer Edge Grinder Collet
A precision collet for securing semiconductor wafers by edge during edge grinding to remove damage layers and achieve exact geometry. This purely mechanical holding fixture has no electrical features and is not specified or included elsewhere in Chapter 84, qualifying under tariff item 8487.90.00.
8487.90.00Wafer Handling Vacuum Chuck
A precision vacuum chuck for holding semiconductor wafers during grinding, lapping, and polishing operations without mechanical clamps. This pneumatic-only design excludes electrical connectors and is not specified or included elsewhere in Chapter 84, falling under tariff item 8487.90.00.
8487.90.00Wafer Lapping Plate
A cast iron or composite lapping plate used in semiconductor wafer grinders and lappers to achieve precise flatness and thickness uniformity on wafer surfaces before fabrication. This purely mechanical surface finishing part has no electrical features and is not specified or included elsewhere in Chapter 84, qualifying under tariff item 8487.90.00.
8487.90.00Wafer Polisher Slurry Distribution Ring
A perforated ring that evenly distributes chemical slurry across the semiconductor wafer surface during polishing operations, critical for uniform material removal rates. This mechanical process part has no electrical features and is not specified or included elsewhere in Chapter 84, falling under tariff item 8487.90.00.
8487.90.00Wafer Slicing Diamond Wire Saw Blade
A precision diamond wire saw blade designed specifically for slicing semiconductor boules into thin wafers with minimal material loss. This consumable cutting part lacks electrical features and is essential for wafer preparation, making it a machinery part not specified or included elsewhere in Chapter 84.
8487.90.00Wafer Sorter Cassette Adapter Plate
A precision adapter plate that aligns FOUP/FOF cassette interfaces with semiconductor wafer sorting and inspection equipment loading stations, ensuring contamination-free wafer transfer. This mechanical alignment part has no electrical features and is not specified or included elsewhere in Chapter 84, qualifying under tariff item 8487.90.00.