Wafer Slicing Diamond Wire Saw Blade
A precision diamond wire saw blade designed specifically for slicing semiconductor boules into thin wafers with minimal material loss. This consumable cutting part lacks electrical features and is essential for wafer preparation, making it a machinery part not specified or included elsewhere in Chapter 84.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the blade is an interchangeable tool for hand tools or machine-tools
Interchangeable tools for working materials are classified in heading 82.07.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Verify the saw blade is not classified as a tool of heading 82.07 (interchangeable tools) — if it is a standard saw blade, it may be excluded
• Provide evidence that it is specifically designed for semiconductor wafer slicing
• Confirm no electrical features are present
Related Products under Tariff item 8487.90.00
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CMP Polisher Retaining Ring
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Crystal Boule Grinder Workholding Chuck
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Double-Sided Wafer Lapper Ring Carrier
A thin ring carrier that holds multiple semiconductor wafers between upper and lower lapping plates for simultaneous double-sided lapping, ensuring uniform material removal across the wafer batch. This non-electrical process part is not specified or included elsewhere in Chapter 84, falling under tariff item 8487.90.00.