Multi-Wire Wafer Slicer
An advanced diamond wire saw using multiple parallel wires to simultaneously slice hundreds of thin wafers from a single boule. It uses fixed abrasive technology to reduce slurry use, maximizing yield and efficiency in wafer production.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine is considered a machine-tool for cutting
Machine-tools for cutting materials are classified in heading 84.61.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the machine is classified as a slicing machine, not as a saw under Chapter 82
• Provide CBSA with technical details showing the multi-wire mechanism
• Check if the diamond wires are classified separately and require their own tariff classification
Related Products under Tariff item 8479.79.00
Boule Diameter Profiler
A precision measuring and grinding station that profiles crystal boules to a uniform cylindrical diameter using laser gauging. It ensures consistent wafer dimensions from variable growth shapes, making it essential for semiconductor material preparation.
Chemical Mechanical Wafer Polisher
A chemical mechanical planarization (CMP) tool that integrates chemical slurry and mechanical polishing to planarize semiconductor wafers. It removes oxide and metal layers uniformly and includes endpoint detection systems for precise control during device fabrication.
Crystal Boule Grinder
A precision grinder that shapes semiconductor crystal boules to exact diameters and grinds flats indicating conductivity type and resistivity. This is a critical step in wafer preparation after crystal growth, ensuring proper orientation for subsequent slicing.
Crystal Defect Etcher
An automated wet bench station that uses chemical etching to reveal and measure bulk defects in semiconductor crystals before wafering. It includes thickness mapping to ensure material quality, functioning as a specialized quality control machine.
Crystal Orientation Grinder
A machine that grinds flats on semiconductor boules at precise crystallographic angles to indicate doping type and resistivity. It uses X-ray diffraction for orientation accuracy, combining grinding with crystallographic measurement.
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon in the Czochralski method. It is essential for semiconductor wafer manufacturing as it creates the pure crystal from which wafers are sliced.