Multi-Wire Wafer Slicer from Japan
An advanced diamond wire saw using multiple parallel wires to simultaneously slice hundreds of thin wafers from a single boule. It uses fixed abrasive technology to reduce slurry use, maximizing yield and efficiency in wafer production.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the machine is classified as a slicing machine, not as a saw under Chapter 82
• Provide CBSA with technical details showing the multi-wire mechanism
• Check if the diamond wires are classified separately and require their own tariff classification