Other
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this Chapter. > Machinery for the extraction or preparation of animal or fixed vegetable or microbial fats or oils > Machinery for the extraction or preparation of animal or fixed vegetable or microbial fats or oils > Other
Duty Rate (from China)
Subheadings
Products classified under Tariff item 8479.79
Boule Diameter Profiler
A precision measuring and grinding station that profiles crystal boules to a uniform cylindrical diameter using laser gauging. It ensures consistent wafer dimensions from variable growth shapes, making it essential for semiconductor material preparation.
8479.79.00Chemical Mechanical Wafer Polisher
A chemical mechanical planarization (CMP) tool that integrates chemical slurry and mechanical polishing to planarize semiconductor wafers. It removes oxide and metal layers uniformly and includes endpoint detection systems for precise control during device fabrication.
8479.79.00Crystal Boule Grinder
A precision grinder that shapes semiconductor crystal boules to exact diameters and grinds flats indicating conductivity type and resistivity. This is a critical step in wafer preparation after crystal growth, ensuring proper orientation for subsequent slicing.
8479.79.00Crystal Defect Etcher
An automated wet bench station that uses chemical etching to reveal and measure bulk defects in semiconductor crystals before wafering. It includes thickness mapping to ensure material quality, functioning as a specialized quality control machine.
8479.79.00Crystal Orientation Grinder
A machine that grinds flats on semiconductor boules at precise crystallographic angles to indicate doping type and resistivity. It uses X-ray diffraction for orientation accuracy, combining grinding with crystallographic measurement.
8479.79.00Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon in the Czochralski method. It is essential for semiconductor wafer manufacturing as it creates the pure crystal from which wafers are sliced.
8479.79.00Double-Sided Wafer Grinder
Equipment that simultaneously grinds both sides of semiconductor wafers using planetary motion and diamond pads for rapid stock removal. It achieves thickness uniformity across 300mm wafers, preparing them for subsequent polishing steps.
8479.79.00Epi-Ready Wafer Polisher
A final polishing station producing 'epi-ready' semiconductor wafers with atomic-level surface flatness for epitaxial layer growth. It uses colloidal silica for a damage-free finish, ensuring the wafer surface is suitable for advanced semiconductor processes.
8479.79.00Float Zone Crystal Grower
Equipment employing the float zone method to purify and grow monocrystalline semiconductor boules without a crucible. It is ideal for high-purity silicon and gallium arsenide, used in the initial stages of semiconductor material production.
8479.79.00Gallium Arsenide Crystal Puller
A specialized vertical Bridgman or LEC puller designed for compound semiconductors like GaAs boule growth from molten flux. It accommodates high-pressure and reactive atmospheres required for III-V materials, making it essential for compound semiconductor manufacturing.
8479.79.00Multi-Wire Wafer Slicer
An advanced diamond wire saw using multiple parallel wires to simultaneously slice hundreds of thin wafers from a single boule. It uses fixed abrasive technology to reduce slurry use, maximizing yield and efficiency in wafer production.
8479.79.00Semiconductor Wafer Slicing Saw
A high-precision inner-diameter saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules with minimal material loss. It ensures flatness and minimal subsurface damage for subsequent processing, critical for semiconductor quality.
8479.79.00Silicon Ingot Trimmer
A precision bandsaw or mill that trims semiconductor ingots to remove peripheral defects and shape them for slicing. It preserves crystal orientation and handles 400mm+ diameters, serving as ingot finishing equipment.
8479.79.00Single Wafer Polishing Tool
An advanced polisher that processes individual semiconductor wafers using chemical-mechanical planarization (CMP) to achieve a mirror-like surface finish. It prepares wafers for photolithography and device formation, ensuring high-quality surfaces.
8479.79.00Wafer Lapping Machine
A mechanical apparatus that uses abrasive slurries to lap semiconductor wafers to precise thickness and flatness tolerances before polishing. It removes saw damage and achieves planarity critical for device fabrication, ensuring wafer quality.