Silicon Wafer Preparation Lapper
A lapping machine that grinds silicon wafers to tight flatness tolerances before fabrication processing. It is critical for achieving precise wafer surfaces, qualifying as a grinding machine for solid mineral substances.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the lapper operates as a machine-tool for finishing surfaces
Machine-tools for finishing metal or cermets by grinding or polishing are classified in heading 84.60.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Clarify that lapping is a grinding process for mineral wafers, not a polishing machine of heading 84.67
• Provide technical specifications to CBSA showing the lapping function
• Verify if the machine is eligible for duty relief under the Machinery Program
Related Products under Tariff item 8474.20.00
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A pre-grinding machine that prepares silicon ingots before multi-wire saw slicing into wafers. It ensures uniform slicing and higher wafer quality by grinding the solid mineral ingot, fitting the definition of a grinding machine for mineral substances.
Czochralski Crystal Puller Grinder
A precision grinding machine used to grind semiconductor crystal boules produced by the Czochralski method to exact diameters for wafer slicing. It processes solid mineral substances, qualifying as a grinding machine under this tariff item.
Diamond Wafer Grinding Machine
A high-precision grinder using diamond abrasives for initial silicon wafer backgrinding, reducing wafer thickness from 700μm to less than 100μm. It grinds solid mineral wafers, fitting the scope of grinding machines for mineral substances.
Float Zone Crystal Boule Grinder
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